<div class="entry-content">
 <div class="jetpack-video-wrapper"><iframe src="https://www.youtube.com/embed/yHn-XOcvJOY" class="youtube-player" width="740" height="416.418" frameborder="0" allowfullscreen></iframe>
 </div>
 <div class="blog-content">
 So, do you only connect one hole or all of them? Do you connect them directly to ground or … ? Taken from my longer interview with Keith Armstrong.
 </div>
 <div class="blog-content-chapters">
 <div>
 Chapters:
 </div>
 <ul class="chapters-list">
 <li class="chapters-list-item">
 00:00Intro
 </li>
 <li class="chapters-list-item">
 02:00What are cavities
 </li>
 <li class="chapters-list-item">
 08:43Bonding options
 </li>
 <li class="chapters-list-item">
 10:00Mounting holes without screws
 </li>
 <li class="chapters-list-item">
 12:40Filters
 </li>
 </ul>
 </div> 
 <div class="blog-content-links">
 <div>
 Links:
 </div>
 <ul class="links-list">
 <li class="links-list-item"><a href="https://fedevel.com/courses/essential-pcb-design-layout-techniques-for-emc">Essential PCB design/layout techniques for good EMC</a></li>
 <li class="links-list-item"><a href="https://youtu.be/gHF5JyJF-N4">Full interview with Keith</a></li>
 </ul>
 </div> 
</div>

Do you connect PCB mounting holes correctly? | Keith Armstrong | #Highlights

<div class="entry-content">
 <div class="jetpack-video-wrapper"><iframe src="https://www.youtube.com/embed/gHF5JyJF-N4" class="youtube-player" width="740" height="416.418" frameborder="0" allowfullscreen></iframe>
 </div>
 <div class="blog-content">
 Answering the questions about EMC that HW engineers often ask when they are designing boards. About EMC and simulators, heatsinks, shielding, filtering, mounting holes, stacked PCBs, guard rings and more …
 </div>
 <div class="blog-content-chapters">
 <div>
 Chapters:
 </div>
 <ul class="chapters-list">
 <li class="chapters-list-item">00:00What this video is going to be about</li>
 <li class="chapters-list-item">01:22EMC Simulation: Ansoft, SIWAVE, Ansys</li>
 <li class="chapters-list-item">09:04Choosing and placing decoupling capacitors</li>
 <li class="chapters-list-item">12:30EMC Simulation: Keysight ADS</li>
 <li class="chapters-list-item">13:37EMC Simulation: CST</li>
 <li class="chapters-list-item">17:34EMC & Chips: Ground bounce</li>
 <li class="chapters-list-item">19:02Video with Eric Bogatin about ground bounce</li>
 <li class="chapters-list-item">22:59Filtering inputs and outputs</li>
 <li class="chapters-list-item">27:51EMC and Heatsink</li>
 <li class="chapters-list-item">37:24Shielding & Filtering: A board with long cables</li>
 <li class="chapters-list-item">47:52How to connect mounting holes</li>
 <li class="chapters-list-item">49:59Stacked boards & EMC</li>
 <li class="chapters-list-item">1:05:11Board Level Shielding</li>
 <li class="chapters-list-item">1:13:22How to connect shielded connectors to enclosure</li>
 <li class="chapters-list-item">1:26:40Placing two boards back to back (front to front) together</li>
 <li class="chapters-list-item">1:29:17Guard ring around PCB</li>
 <li class="chapters-list-item">1:36:48EMC and PCB board edge</li>
 <li class="chapters-list-item">1:43:03Guard ring: VIA wall vs Edge plating</li>
 <li class="chapters-list-item">1:45:00Guard ring and Shielded connectors - How to connect them</li>
 </ul>
 </div> 
 <div class="blog-content-links">
 <div>
 Links:
 </div>
 <ul class="links-list">
 <li class="links-list-item"><a href="https://fedevel.com/courses/essential-pcb-design-layout-techniques-for-emc">Essential PCB design/layout techniques for good EMC</a></li>
 <li class="links-list-item"><a href="https://www.linkedin.com/in/keith-armstrong-449801172/">Keith Armstrong LinkedIn</a></li>
 <li class="links-list-item"><a href="https://www.emcstandards.co.uk/">EMC Standards website</a></li>
 </ul>
 </div> 
</div>

Many EMC Tips to Help You Design Better PCB Boards (with Keith Armstrong)

Extended bundle of courses about Schematic Design, PCB Layout and EMC. For companies and individuals designing electronic boards and systems.

The essential online courses teaching about hardware design and PCB Layout

Three hardware design courses and EMC

Learn Altium Essentials Second Edition

Advanced Hardware Design

Advanced PCB Layout Course

Essential PCB design/layout techniques for good EMC

Practical EMC Training for Design Engineers

FREE: Advanced Hardware Design Second Edition - Early Access

Includes: Online video access for 8-12 weeks (different between courses) Can be extended by 1 month for FREE The first lesson is available after payment, then next lessons open every 7 days (depending on course)1 certificate (if you complete the course activities) 100% money-back guarantee up to 30 days from order

Online

Includes: Online video access for 8-12 weeks (different between courses) Online access for up to 3 people per each course. In total, up to 9 Online licenses. Every online access can be extended 2 times for FREE, each time for 1 more month ALL lessons accessible immediately after payment Unlimited video access (after downloaded) Video download available (after 30 days) Certificates for up to 3 people from your company (if you complete activities) 100% money-back guarantee up to 30 days from order

Online and Download

(Recommended)

Includes: Online video access for 8-12 weeks (different between courses) Online access for up to 5 people per each course. In total, up to 15 Online licenses. Every online access can be extended 3 times for FREE, each time for 1 more month ALL lessons accessible immediately after payment Unlimited video access (after downloaded) Video download available immediately after payment Certificates for up to 5 people from your company (if you complete activities) 100% money-back guarantee up to 30 days from order

Quick Download

Extra Online licenses for Online and Download or Quick Download options You will get 3 extra Online licenses, one for each course in this package

Additional Online license

Extra Online licenses for Online and Download or Quick Download options. For Companies, which need additional online access to this course for their engineers.

Paper certificate

That the most cost-effective place to achieve good Signal Integrity (SI), Power Integrity (PI), and EMC, is in the design and layout of the printed circuit board (PCB).

What will you learn?

This course is designed to help engineers involved with the design, test and approval of PCBs and the equipment and assemblies in which they are used, to learn more about Electromagnetic Compatibility (EMC) and the issues which affect it. 

The course conveys the issues with a minimum of maths and a maximum of practical guidance in order to ensure that people can find the answers they are looking for but with the necessary underpinning for those who want a deeper understanding.

Who is this course for?

The course is a step by step video which provides guidelines for cost-effective Signal Integrity (SI), Power Integrity (PI) and Electromagnetic Compatibility (EMC) in the design and layout of printed circuit boards (PCBs)

 

You will learn about
<ul><li>Saving time and money</li>
<li>Scope and application of these design techniques</li>
<li>EM Zoning (i.e. segregation)</li>
<li>Interface analysis, filtering, and suppression)</li>
<li>Planes for 0V(GND) and other power rails (PWR)</li>
<li>RF-bonding PCB Reference Planes at EMZ boundaries</li>
<li>Power supply decoupling</li>
<li>Switching power converters (AC/DC, DC/DC, DC/AC, etc.)</li>
<li>Matched transmission line techniques</li>
<li>Layer stacking and trace routing</li>
<li>Devices with BGA packages and/or multiple DC rails</li>
<li>Some useful references, sources, and webinars</li>
</ul>

Description

Every student who actively engages with course and provides a completed Course Evaluation form will receive a certificate.

Certificate

Price

Total 7 lessons. Total course length is approximately 5 hours.

Duration

There are no specific requirements for the course, although it may be helpful for you to be able to download and print the lessons in addition to viewing the training videos.

Requirements

Very compact knowledge, still have to repeat this, will be very helpfull for the future design.

Great info, I can't believe this stuff isn't taught in schools yet!

The most cost-effective place to achieve good Signal Integrity (SI), Power Integrity (PI), and EMC, is in the design and layout of the printed circuit board (PCB). 



The most cost-effective place to achieve good Signal Integrity (SI), Power Integrity (PI), and EMC, is in the design and layout of the printed circuit board (PCB).This course is designed to help engineers involved with the design, test and approval of PCBs and the equipment and assemblies in which they are used, to learn more about Electromagnetic Compatibility (EMC) and the issues which affect it. The course conveys the issues with a minimum of maths and a maximum of practical guidance in order to ensure that people can find the answers they are looking for but with the necessary underpinning for those who want a deeper understanding.

Saving time and money, Scope and application of these design techniques, EM Zoning (i.e. segregation), Interface analysis, filtering, and suppression), Planes for 0V(GND) and other power rails (PWR), RF-bonding PCB Reference Planes at EMZ boundaries, Power supply decoupling, Switching power converters (AC/DC, DC/DC, DC/AC, etc.), Matched transmission line techniques, Layer stacking and trace routing, Devices with BGA packages and/or multiple DC rails, Some useful references, sources, and webinars

<ul>
<li>Learn the most effective way of designing a PCB/Assembly</li>
<li>Find out about Signal Integrity (SI), Power Integrity (PI) and EMC techniques</li>
<li>Identify EM Zones and their boundaries (i.e. segregation)</li>
<li>Analyse each interface between EM Zones for electromagnetic phenomena</li>
</ul>

Learn the most effective way of designing a PCB/Assembly. Find out about Signal Integrity (SI), Power Integrity (PI) and EMC techniques. Identify EM Zones and their boundaries (i.e. segregation). Analyse each interface between EM Zones for electromagnetic phenomena.

Saving time, application of design techniques, EM Zoning, Interface Analysis

<ul>
<li>Benefits of Solid Reference Plane</li>
<li>Problems with plane perforation</li>
<li>How not to design a 2-layer PCB</li>
<li>Real world examples</li>
</ul>

Benefits of Solid Reference Plane. Problems with plane perforation. How not to design a 2-layer PCB. Real world examples.

Planes for 0V(GND) and other power rails (PWR)

<ul>
<li>Cost effective ways to create a EM Zone boundary</li>
<li>Example of galvanically isolated Reference Plane</li>
<li>Example of PCB-chassis RF bond</li>
<li>An easier way to assemble multiple RF-bonds</li>
</ul>

Cost effective ways to create a EM Zone boundary. Example of galvanically isolated Reference Plane. Example of PCB-chassis RF bond. An easier way to assemble multiple RF-bonds.

RF-bonding PCBs to the RFREF (e.g. ‘chassis’, ‘shield’, etc.) at an EM Zone Boundary

<ul>
<li>Why ICs need low power supply impedance</li>
<li>Good decoupling is also needed for good signal integrity SI</li>
<li>Best decaps and minimising inductances</li>
<li>Using ferrites</li>

</ul>

Why ICs need low power supply impedance. Good decoupling is also needed for good signal integrity SI. Best decaps and minimising inductances. Using ferrites.

Power supply decoupling

<ul>
<li>Why Switching power converters cause EMC problems</li>
<li>Problems with single-sided PCBs</li>
<li>Desirable storage capacitor values</li>
<li>Reduce series resistances and series inductances</li>

</ul>

Why Switching power converters cause EMC problems. Problems with single-sided PCBs. Desirable storage capacitor values. Reduce series resistances and series inductances.

Switching power converters (AC/DC, DC/DC, DC/AC, etc.)

<ul>
<li>More than 30 types of transmission line</li>
<li>Problems with Digital Industry guidance for good SI</li>
<li>Reduce overall cost of manufacturing</li>
<li>Why is it bad to filter IC outputs with capcitors alone</li>

</ul>

More than 30 types of transmission line. Problems with Digital Industry guidance for good SI. Reduce overall cost of manufacturing. Why is it bad to filter IC outputs with capacitors alone?

Matched transmission line techniques

<ul>
<li>Trace routing rules</li>
<li>Which layer stack-up is no good for EMC </li>
<li>Best PCB technology when using BGA devices</li>
<li>Reduce RF noise in a 'noisy' power place </li>

</ul>

Trace routing rules<. Which layer stack-up is no good for EMC. Best PCB technology when using BGA devices. Reduce RF noise in a 'noisy' power place.

Layer stacking and trace routing, Devices with BGA packages, Useful references

Includes: Online video access for 12 weeks (can be extended by 1 month for FREE) The first lesson is available after payment, then next lessons open every 7 days1 certificate (if you complete activities) 100% money-back guarantee up to 30 days from order

Includes: Online access to this course for up to 3 people, each access for 12 weeks Every online access can be extended 2 times for FREE, each time for 1 more month ALL lessons accessible immediately after payment Unlimited video access (after downloaded) Video download available (after 30 days) Certificate for up to 3 people (when they complete activities) 100% money-back guarantee up to 30 days from order

Includes: Online access to this course for up to 5 people, each access for 12 weeks Every online access can be extended 3 times for FREE, each time for 1 more month ALL lessons accessible immediately after payment Unlimited video access (after downloaded) Video download available immediately after payment Certificate for up to 5 people (when they complete activities) 100% money-back guarantee up to 30 days from order

Upgrade to Online and Download

Upgrade to Quick Download

Unlock all lessons

Extend video access (1 month)

Extend video access (3 months)

Extend video access (6 months)

Extend video access (12 months)

Extra Online licenses for Online and Download or Quick Download options

Extra Online license

Paper certificate upgrade

We can buy (or easily make our own) near-field probes, which are very powerful indeed even used with low-cost Spectrum Analyzers.

 

For example a simple 15mm loop of plain wire with a low cost Spectrum Analyzer is able to easily identify potential test failures and save months of repetitively respinning designs and retesting in expensive EMC labs… 

 

When people learn how to use near-field probes repeatably, they always wonder how they ever managed without them!

This course is designed to help engineers involved with the design, test and approval of PCBs and the equipment and assemblies in which they are used, to learn more about Electromagnetic Compatibility (EMC) and the issues which affect it. The course is very practical and designed for those who are familiar with electronic 'bench work' and provides a hands on approach to solving Radiated Emissions problems.

The course is a step by step video which provides guidelines for low-cost, quick, benchtop EMC testing to help de-risk at all project stages

 

You will learn about

<li>Near fields and near-field probing 
<li>Making your own near-field probe 
<li>Buying near-field probes 
<li>Affordable spectrum analyzers 
<li>Using near-field probes to check emissions 
<li>Avoiding overload (including by out of band signals and intermodulation) 
<li>RF Current Monitor Probing 
<li>Making current monitor probes 
<li>Buying current monitor probes 
<li>Using current monitor probes 
<li>Using current monitor probes to predict radiated emissions on full-compliance tests 
<li>Some useful references, sources, and webinars 
</ul>

Total 2 lessons. Total course length is approximately 1 hour.

There are no specific requirements for the course, although it may be helpful for you to be able to download and print the lessons in addition to viewing the training videos

This course demonstrates how, when combined with a cheap Spectrum Analyzer, we can use low cost or even home-made near field probe to quickly find problem areas that Radiated/Immunity tests in a Lab simply cannot.

This course demonstrates how, when combined with a cheap Spectrum Analyzer, we can use low cost or even home-made near field probe to quickly find problem areas that Radiated/Immunity tests in a Lab simply cannot.This course is designed to help engineers involved with the design, test and approval of PCBs and the equipment and assemblies in which they are used, to learn more about Electromagnetic Compatibility (EMC) and the issues which affect it. The course is very practical and designed for those who are familiar with electronic 'bench work' and provides a hands on approach to solving Radiated Emissions problems.

This course demonstrates how, when combined with a cheap Spectrum Analyzer, we can use low cost or even home-made near field probes to quickly find problem areas that Radiated/Immunity tests in a Lab simply cannot.

Low-cost, quick, bench top EMC Testing

Low-cost, quick, bench top EMC Testing using near-field probes

Near fields and near-field probing, Making your own near-field probe, Buying near-field probes, Affordable spectrum analyzers, Using near-field probes to check emissions, Avoiding overload (including by out of band signals and intermodulation), RF Current Monitor Probing, Making current monitor probes, Buying current monitor probes, Using current monitor probes, Using current monitor probes to predict radiated emissions on full-compliance tests, Some useful references, sources, and webinars

<ul>
<li>Introduction to near-field probes and how to use them</li>
<li>Making and buying near-field probes</li>
<li>Spectrum Analyzers, traditional and 'real-time' types</li>
<li>Using near-field probes to check emissions and avoid overloads</li>
</ul>

Introduction to near-field probes and their proper usage. Discovering the differences between making and buying these probes. Understanding the nuances of traditional and real-time spectrum analyzers. Gaining insights on employing near-field probes to assess emissions and prevent overloads.

Near-Field Probing

<ul>
<li>Making current monitor probes</li>
<li>Buying current monitor probes</li>
<li>Using current monitor probes</li>
<li>Using current monitor probes to predict radiated emissions test results</li>
</ul>

Learning about RF current monitor probes, including how to make and purchase them. Understanding the proper usage of these probes and exploring their application in predicting radiated emissions test results.

RF Current Probes

This course provides Advanced techniques for achieving good Signal Integrity (SI), Power Integrity (PI), and EMC in the design and layout of the printed circuit board (PCB).

This course is designed to help engineers involved with the design, test and approval of Advanced level PCBs and the equipment and assemblies in which they are used, to learn more about Electromagnetic Compatibility (EMC) and the issues which affect it. 

The course conveys the issues with a minimum of maths and a maximum of practical guidance in order to ensure that people can find the answers they are looking for but with the necessary underpinning for those who want a deeper understanding.

The course is a step by step video which provides guidelines for cost-effective Signal Integrity (SI), Power Integrity (PI) and Electromagnetic Compatibility (EMC) in the design and layout of Advanced printed circuit boards (PCBs)

 

You will learn about
<ul><li>When should we use advanced techniques</li>
<li>Future trends and their implications</li>
<li>Guidelines, approximations, simulations and virtual design</li>
<li>Advanced EM zoning</li>
<li>Planes for 0V(GND) and other power rails (PWR)</li>
<li>RF-bonding PCB Reference Planes at EMZ boundaries</li>
<li>Power supply decoupling</li>
<li>Switching power converters (AC/DC, DC/DC, DC/AC, etc.)</li>
<li>Matched transmission line techniques</li>
<li>Layer stacking and trace routing</li>
<li>Devices with BGA packages and/or multiple DC rails</li>
<li>Some useful references, sources, and webinars</li>
</ul>

Total 18 lessons. Total course length is approximately 6,5 hours.

The most cost-effective place to achieve good Signal Integrity (SI), Power Integrity (PI), and EMC, is in the design and layout of the printed circuit board (PCB) and this course Advanced course builds on the techniques in my Essential course

The most cost-effective place to achieve good Signal Integrity (SI), Power Integrity (PI), and EMC, is in the design and layout of the printed circuit board (PCB) and this Advanced course builds on the techniques in the Essential PCB design/layout techniques for good EMC course.This course is designed to help engineers involved with the design, test and approval of Advanced level PCBs and the equipment and assemblies in which they are used, to learn more about Electromagnetic Compatibility (EMC) and the issues which affect it. The course conveys the issues with a minimum of maths and a maximum of practical guidance in order to ensure that people can find the answers they are looking for but with the necessary underpinning for those who want a deeper understanding. Before taking this course, we highly recommend taking the Essential PCB design/layout techniques for good EMC course first for better understanding.

Advanced PCB design/layout techniques for good EMC

When should we use advanced techniques, Future trends and their implications, Guidelines, approximations, simulations and virtual design, Advanced EM zoning, Planes for 0V(GND) and other power rails (PWR), RF-bonding PCB Reference Planes at EMZ boundaries, Power supply decoupling, Switching power converters (AC/DC, DC/DC, DC/AC, etc.), Matched transmission line techniques, Layer stacking and trace routing, Devices with BGA packages and/or multiple DC rails, Some useful references, sources, and webinars

<ul>
<li>Why use Advanced PCB techniques?</li>
<li>Reduce costs</li>
<li>Increase performance</li>
<li>When do we need advanced techniques?</li>
</ul>

Why use Advanced PCB techniques? Reduce costs. Increase performance. When do we need advanced techniques?

When should we use advanced PCB techniques?

<ul>
<li>IC trends</li>
<li>PCB trends</li>
<li>EMC testing trends</li>
<li>Future trends</li>
</ul>

IC trends. PCB trends. EMC testing trends. Future trends.

Future trends and their implications

<ul>
<li>PCB design techniques</li>
<li>Design challenges</li>
<li>Successful strategies</li>
<li>The business case</li>
</ul>

PCB design techniques, guidelines, approximations and simulations. Design challenges. Successful strategies. The business case. SI, PI and EMC right the first time.

Guidelines, approximations, simulations, and virtual design for SI, PI and EMC

<ul>
<li>Follow layout guidelines from IC manufacturers</li>
<li>Emissions from PCBs can be dominated by IC emissions</li>
<li>Reference Plane fill/flood</li>
<li>Reduce emissions by using Nickel / ENIG plating</li>
</ul>

Follow layout guidelines from IC manufacturers. Advanced PCB segregation. Emissions from PCBs can be dominated by IC emissions. Reference Plane fill/flood. Reduce emissions by using Nickel / ENIG plating.

Advanced EM Zoning (segregation) techniques

<ul>
<li>Types of board level shielding</li>
<li>Crossing one boundaries</li>
<li>Improve filter performance</li>
<li>Improving the via wall</li>
</ul>

Multiple BLS examples - types of board level shielding. Crossing zone boundaries with filters/chips. Improving filter performance, advanced filter supression. Cavity resonances inside BLS cans. Improving the Via wall.

Advanced interface filtering and suppression

<ul>
<li>Choosing a method</li>
<li>Damping resonances</li>
<li>Practical example of RF-bonding</li>
<li>Use absorbers to dampen cavity resonances</li>
</ul>

Choosing a method. Damping resonances. Practical example of RF-bonding. Use absorbers to dampen cavity resonances.

Advanced RF-bonding of PCB reference planes

<ul>
<li>Advanced PCB planes</li>
<li>Problems with plan perforation</li>
<li>What Fmax guidelines are not appropriate for transmitters</li>
<li>Biggest problems with receivers</li>
</ul>

Advanced PCB planes. Problems with plan perforation. What Fmax guidelines are not appropriate for transmitters. Biggest problems with receivers. Co-locating radio/wireless antennas.

Advanced PCB planes and co-locating wireless antennas

<ul>
<li>How can we shield a PCB?</li>
<li>Fully shielded PCB/cable assembly</li>
<li>Partially shielded PCB/cable assembly</li>
<li>Problems with conformal coating</li>
</ul>

How to totally shield a PCB? Fully shielded PCB/cable assembly. Partially shielded PCB/cable assembly. Problems with conformal coating.

The totally shielded board assembly

<ul>
<li>Cavity resonances</li>
<li>Increase resonant frequencies by bonding planes</li>
<li>Ferrite PCBs?</li>
<li>Metamaterials</li>
<ul>

Cavity resonances. RF-bonding planes together to increase resonant frequencies. Alternatives for damping plane-pair resonance. Ferrite PCBs? Metamaterials.

Damping resonances in parallel metal structures

<ul>
<li>Best location for decaps</li>
<li>Benefits of using Via-in-pad</li>
<li>Choosing decaps</li>
<li>X2Y devices</li>
<ul>

The best locations for decaps. Benefits of using Via-in-pad. Choosing decaps. X2Y capacitors and devices.

Advanced PCB decoupling

<ul>
<li>Buried discrete components</li>
<li>Surge protecting layers</li>
<li>Buried capacitance</li>
<li>Transmission line approach to prevent plane resonances</li>
</ul>

Buried discrete components. Surge protecting layers. Buried capacitance. Transmission line approach to prevent plane resonances.

Buried components, especially buried capacitance decoupling

<ul>
<li>The legacy material in Section 12 ‘Traces crossing plane splits and gaps’, has been moved to appropriate sections in Module 6A, and modified</li>
 
<li>In Advanced PCB EMC design, we should now no longer cross any plane splits or gaps, with any traces!</li>
</ul>

Traces crossing plane splits and gaps’ has been moved to appropriate sections in Module 6A, and modified. In Advanced PCB EMC design, we should now no longer cross any plane splits or gaps, with any traces!

NOT USED IN THIS VERSION!

<ul>
<li>Problems with modern ICs</li>
<li>Simulating conductor and dielectric losses</li>
<li>Causes of differential imbalance</li>
<li>Asymmetries</li>
</ul>

Problems with modern ICs. Example TDR measurements on a PCB. Trace lengths. Simulating conductor and dielectric losses. Causes of differential imbalance. Asymmetries.

Advanced transmission lines

<ul>
<li>High Density Interconnect (HDI) technology</li>
<li>EMC benefits</li>
<li>Examples of PCBs</li>
<li>Stack-ups for good PI and EMC</li>
</ul>

High Density Interconnect (HDI) technology. EMC benefits. Examples of PCBs. Stack-ups for good PI and EMC.

Microvia board manufacturing techniques

<ul>
<li>3D Moulded PCBs</li>
<li>Additive Manufacturing</li>
<li>Replacing PCBs with Silicon interconnect fabric (SIF)</li>
<li>Replacing Chips with Chiplets</li>
</ul>

3D molded PCBs. Additive Manufacturing. Replacing PCBs with Silicon interconnect fabric (SIF). Replacing Chips with Chiplets.

Future Developments

<ul>
<li>Using low-k dielectrics</li>
<li>Examples of crosstalk</li>
<li>Always simulate the crosstalk</li>
<li>What to do when signals have different thresholds</li>
</ul>

Using low-k dielectrics. Examples of crosstalk. Always simulate the crosstalk. What to do when signals have different thresholds.

Advanced Crosstalk

<ul>
<li>EMC issues with 'in-circuit' tests</li>
<li>Save money with your PCB assemblers</li>
<li>What to do with a used cable or bus</li>
<li>What to do with unused outputs</li>
</ul>

EMC issues with 'in-circuit' tests. Save money with your PCB assemblers. What to do with a used cable or bus. What to do with unused outputs.

Some final tips and tricks

<ul>
<li>References in the slides</li>
<li>Suppliers of EMC simulators</li>
<li>Sources for HDI</li>
<li>Sources for embedded/buried PCB components</li>
</ul>

References in the slides. Suppliers of EMC simulators. Sources for HDI. Sources for embedded/buried PCB components. Useful references.

Some useful contacts, sources and references

This module is based on many years of solving EMC problems in a wide range of electrical / electronic assemblies, systems, and installations to improve functionality and reliability (and also to meet EMC standards) the methods described generally correspond with BS IEC TR 61000-5-2:1997 and BS IEC TR 61000-5-6

 

This presentation uses examples based on industrial applications…
but these techniques can easily be extended to cover any electrical / electronic applications

This course is for engineers at all levels who are responsible for the design, development, production, manufacturing/construction and maintenance of Equipment, Systems and Installations.
 
This presentation uses examples based on industrial application and these techniques can easily be extended to cover any electrical / electronic applications, with a minium of mathematics!

 

It may be especially helpful for so called 'Responsible Persons' who according to EMC Directive 2014/30/EU will be expected to document and keep records to prove that good engineering practices were and continue to be followed.

The course is a step by step video which provides EM Engineering guidelines that should also be used as an initial design checklist: any that can’t or won’t be followed identify a project risk and also to troubleshoot installation, equipment and systems at any stage throughout an operational life cycle!

Remember, identifying risks and potential problems at the design/prototype stages is much faster and cheaper!




 

You will learn about
<ul>
<li>Planning 
<li>Dealing with legacy equipment, systems and installations 
<li>Buying equipment; and CE + CE ≠ CE 
<li>Power distribution systems; and power quality for EMC 
<li>Galvanic isolation for EMC 
<li>Segregation (EM Zoning) 
<li>Cable classification, segregation, and routing 
<li>Using Bonding Ring Conductors (BRCs) 
<li>Creating an RF Reference by RF-bonding conductors and/or metalwork 
<li>Terminating cable shields at EM Zone boundaries, at both ends 
<li>Reducing the ‘accidental RF antenna’ efficiency of cables 
<li>Terminating cable shields at EM Zone boundaries, at both ends 

<li>Using Parallel Earth Conductors (PECs) 
<li>Preventing corrosion 
<li>Earthing/grounding for both Safety and EMC Zoning 
<li>Using Meshed Bonding Networks as RF References 
<li>What to do when EM Zones must be isolated 
<li>Filtering for EM Zoning 
<li>Shielding for EM Zoning 
<li>RF-bonding filters to shielded EMZs where cables enter/exit 
<li>RF-bonding cable shields/screens to shielded EM Zones at entry/exit 
<li>Surge and Lightning protection 

<li>Maintaining good EMC over the operational lifecycle 
<li>Some useful references 
<li>Bonus: Alain Charoy’s presentation on EMC fixes and mistakes 
</ul>

Total 9 lessons. Total course length is approximately 9 hours.

This course is for engineers at all levels who are responsible for the design, development, production, manufacturing/construction and maintenance of Equipment, Systems and Installations.
 
This presentation uses examples based on industrial application and these techniques can easily be extended to cover any electrical / electronic applications, with a minium of mathematics!

This course is for engineers at all levels who are responsible for the design, development, production, manufacturing/construction and maintenance of Equipment, Systems and Installations.This presentation uses examples based on industrial application and these techniques can easily be extended to cover any electrical / electronic applications, with a minium of mathematics!This course is for engineers at all levels who are responsible for the design, development, production, manufacturing/construction and maintenance of Equipment, Systems and Installations.

This Module contains many EM Engineering guidelines that should also be used as an initial design checklist: any that can’t or won’t be followed identify a project risk!

Good EMC Engineering for Equipment, Systems and Installations

Planning, Legacy equipment, systems and installations, Equipment choice, Power distribution systems; Power quality, Galvanic isolation for EMC, Segregation (EM Zoning), Cable classification, Bonding Ring Conductors (BRCs), RF Reference, Terminating cable shields, Parallel Earth Conductors (PECs), Preventing corrosion, Safety and EMC Zoning, Meshed Bonding Networks, Filtering and Shielding for EM, RF-bonding filters, RF-bonding cable shields/screens, Surge and Lightning protection, EMC maintenance

<ul>
<li>The new EMC Directive 2014/30/EU</li>
<li>Lightning protection for electronics</li>
<li>National Wiring Regulations</li>
<li>Good EMC engineering practices</li>
</ul>

The new EMC Directive 2014/30/EU. Lightning protection for electronics. National Wiring Regulations. Good EMC engineering practices. Using guidelines as a checklist in design, commissioning, or fault-finding.

Good Electromagnetic (EM) Engineering - Introduction

<ul>
<li>Variable Speed Drives </li>
<li>Legacy Equipment</li>
<li>Improving Power Quality</li>
<li>Galvanic Isolation for EMC</li>
</ul>

Planning is a good EMC practice. About variable speed drives, legacy equipment and buying new equipment. Power distribution systems and Improving power quality. Galvanic Isolation for EMC.

EMI is getting worse!

<ul>
<li>Mains isolating transformers </li>
<li>Cable classification</li>
<li>Cable segregation</li>
<li>What to do when segregation cannot be achieved</li>
</ul>

Mains isolating transformers. Cable classification and cable segregation. What to do when segregation cannot be achieved. Assembly details for the motor drive area. Segregation in a 19 rack cabinet.

Segregation (EM Zoning) the low-cost way to control EMC

<ul>
<li>Using Bonding Ring Conductors (BRCs) </li>
<li>Creating an RF Reference </li>
<li>RF Bonding Techniques</li>
<li>RF Bonding cable shields at both ends</li>
</ul>

Using Bonding Ring Conductors (BRCs). Creating an RF Reference. RF Bonding Techniques. RF Bonding cable shields at both ends.

Good EMC for Installations

<ul>
<li>Reducing the ‘accidental antenna</li>
<li>Interconnections for improved EMC </li>
<li>Cable routing</li>
<li>Parallel Earth Conductors (PECs)</li>
</ul>

Reducing the ‘accidental antenna. Interconnections for improved EMC. Cable routing. Parallel Earth Conductors (PECs). Preventing corrosion

Good EMC for Installations /-continued

<ul>
<li>EM Zoning to control EM Environments</li>
<li>Using Meshed Common Bonding Networks (MESH-CBNs)</li>
<li>Mesh Dimensions</li>
<li>Meshed floors for IT / telco rooms</li>
</ul>

EM Mitigation techniques. EM Zoning to control EM Environments. Using Meshed Common Bonding Networks (MESH-CBNs). Mesh Dimensions. Meshed floors for IT / telco rooms. Using Meshed isolated bonding networks.

EM Mitigation Techniques

<ul>
<li>What to do when EM Zones must be isolated</li>
<li>Filtering for EM Zoning</li>
<li>Indirect RF-bonding for unshielded cables</li>
<li>Shielding for EM Zoning</li>
</ul>

What to do when EM Zones must be isolated. Filtering for EM Zoning. Indirect RF-bonding for unshielded cables. Shielding for EM Zoning. EMC gaskets. Shielding large EMC Zones. Shielding at EM-Zone boundaries.

EM Mitigation Techniques /- continued

<ul>
<li>RF-bonding filters to shielded EM Zones</li>
<li>RF-bonding cable/screens to shielded EM Zones</li>
<li>RF-bonding cable/screens in explosion-proof Zone boundaries</li>
<li>Surge and Lightning Protection</li>
</ul>

RF-bonding filters to shielded EM Zones. RF-bonding cable/screens to shielded EM Zones. RF-bonding cable/screens in explosion-proof Zone boundaries. Surge and Lightning Protection.

<ul>
<li>Metalwork and Mesh-IBNs</li>
<li>EMC performance degrades over time</li>
<li>Some useful references</li>
<li>Alain Charoy's presentation on EMC fixes and mistakes</li>
</ul>

Metalwork and Mesh-IBNs. EMC performance degrades over time. Some useful references. Alain Charoy's presentation on EMC fixes and mistakes.

Maintaining good EMC characteristics over the operational lifecycle

This Module contains many EM Engineering guidelines that should also be used as an initial design checklist to De-Risk a project’s EMC...
 

Remember, any guideline that can’t or won’t be followed identifies a project EMC risk!

This course is designed to help engineers involved with the design, test and approval of PCBs modules, sub-assemblies, devices, products, equipment, vehicles, sub-systems, systems, installations, etc.; of any size, in all applications and the equipment and assemblies in which they are used, to learn more about Electromagnetic Compatibility (EMC) and the issues which affect it. 
 
The course conveys the issues with a minimum of maths and a maximum of practical guidance in order to ensure that people can find the answers they are looking for but with the necessary underpinning for those who want a deeper understanding.

The course is a step by step video which provides guidelines for the use of filters, their design and problems when used in the design and layout of equipment and systems which use Printed Circuit Boards (PCBs)

 

You will learn about
<li>Filtering is not ‘black magic’ 
<li>How filters work 
<li>The advantages of soft ferrites 
<li>CM filtering 
<li>Specifying filters 
<li>Real-life problems with resonances, inductors, capacitors 
<li>Earth leakage currents, safety, and component selection 
<li>Filter construction, mounting, and cabling 
<li>The synergy of filtering and shielding 
<li>Some useful references and tools 
</ul>

Total 11 lessons. Total course length is approximately 2 hours.

There are no specific requirements for the course.

Good Electromagnetic (EM) Engineering is cost-effective SI, PI and EMC engineering! This Module contains many EM Engineering guidelines that should also be used as an initial design checklist to De-Risk a project’s EMC: any guideline that can’t or won’t be followed identifies a project EMC risk! My courses are well-proven to save time & money in all lifecycle stages, helping to increase profits & reduce financial risks.

Good Electromagnetic (EM) Engineering is cost-effective SI, PI and EMC engineering! This Module contains many EM Engineering guidelines that should also be used as an initial design checklist to De-Risk a project’s EMC: any guideline that can’t or won’t be followed identifies a project EMC risk!This course is designed to help engineers involved with the design, test and approval of PCBs modules, sub-assemblies, devices, products, equipment, vehicles, sub-systems, systems, installations, etc.; of any size, in all applications and the equipment and assemblies in which they are used, to learn more about Electromagnetic Compatibility (EMC) and the issues which affect it.

Good Electromagnetic (EM) Engineering… is cost-effective SI, PI and EMC engineering!
 
This Module contains many EM Engineering guidelines that should also be used as an initial design checklist to De-Risk a project’s EMC: any guideline that can’t or won’t be followed identifies a project EMC risk!
 
My courses are well-proven to save time & money in all lifecycle stages, helping to increase profits & reduce financial risks.

Filtering for EMC

Filtering is not ‘black magic’, How filters work, The advantages of soft ferrites, CM filtering, Specifying filters, Real-life problems with resonances, inductors, capacitors, Earth leakage currents, safety, and component selection, Filter construction, mounting, and cabling, The synergy of filtering and shielding, Some useful references and tools

Cost-effective SI, PI and EMC engineering:
<ul>
<li>Well-proven to save time & money in all lifecycle stages</li>
<li>Helping to increase profits & reduce financial risks</li>
<li>Can help de-risk a product at the initial stages</li>
</ul>

Cost-effective SI, PI and EMC engineering. Well-proven to save time & money in all lifecycle stages. Helping to increase profits & reduce financial risks. Can help de-risk a product at the initial stages.

| OUR INSTRUCTOR

Keith Armstrong

Instructor Keith Armstrong in numbers

Keith Armstrong's Top Courses

Three hardware design courses and EMC

Essential PCB design/layout techniques for good EMC

Low-cost, quick, bench top EMC Testing using near-field probes

Advanced PCB design/layout techniques for good EMC

Good EMC Engineering for Equipment, Systems and Installations

Filtering for EMC

Videos with Keith Armstrong

Videos with Keith Armstrong

Get to know our highly
experienced instructors

Didn't find what you were looking for?

BUSINESS ADDRESS

| OUR INSTRUCTOR

Keith Armstrong

Instructor Keith Armstrong in numbers

Keith Armstrong's Top Courses

Three hardware design courses and EMC

Essential PCB design/layout techniques for good EMC

Low-cost, quick, bench top EMC Testing using near-field probes

Advanced PCB design/layout techniques for good EMC

Good EMC Engineering for Equipment, Systems and Installations

Filtering for EMC

Videos with Keith Armstrong

Videos with Keith Armstrong

Get to know our highlyexperienced instructors

Didn't find what you were looking for?

Get to know our highly
experienced instructors