<div class="entry-content">
 <div class="jetpack-video-wrapper"><iframe
 class="youtube-player"
 src="https://www.youtube.com/embed/9B66SqaYCZs?version=3&rel=1&showsearch=0&showinfo=1&iv_load_policy=1&fs=1&hl=en&autohide=2&wmode=transparent"
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 <div class="blog-content">
 How the model of PCB used in high speed board simulations is created. Explained by Eric Bogatin. Thank you Eric.
 </div>
 <div class="blog-content-chapters">
 <div>
 Chapters:
 </div>
 <ul class="chapters-list">
 <li class="chapters-list-item">
 00:00What is this video about
 </li>
 <li class="chapters-list-item">
 00:29What are s-Parameters, Why we need them
 </li>
 <li class="chapters-list-item">
 05:51How S-Parameters models are created
 </li>
 <li class="chapters-list-item">
 08:02Including components in simulations with S-Parameters
 </li>
 <li class="chapters-list-item">
 14:44What is in S-Parameters file?
 </li>
 <li class="chapters-list-item">
 17:10Opening and explaining S-Parameters file
 </li>
 <li class="chapters-list-item">
 23:04S-Parameters ports explained – what they are
 </li>
 <li class="chapters-list-item">
 26:09Floating ports
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 <li class="chapters-list-item">
 30:23S-Parameters numbers explained
 </li>
 <li class="chapters-list-item">
 30:59What ports to use when using S-Parameters model
 </li>
 </ul>
 </div>
 <div class="blog-content-links">
 <div>
 Links:
 </div>
 <ul class="links-list">
 <li class="links-list-item"><a href="https://www.bethesignal.com/bogatin/3monthsubscription.php">Signal Integrity Academy (use FEDSI - 3 months free)</a></li>
 <li class="links-list-item"><a href="https://fedevel.com/courses">FEDEVEL courses</a></li>
 </ul>
 </div> 
</div>

Must Know This to Understand High Speed PCB Layout Simulation | S-Parameters Explained, Eric Bogatin

<div class="entry-content">
 <div class="jetpack-video-wrapper"><iframe
 class="youtube-player"
 src="https://www.youtube.com/embed/kdCJxdR7L_I?version=3&rel=1&showsearch=0&showinfo=1&iv_load_policy=1&fs=1&hl=en&autohide=2&wmode=transparent"
 allowfullscreen="true"
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 sandbox="allow-scripts allow-same-origin allow-popups allow-presentation"
 data-ratio="0.5627272727272727" data-width="1100" data-height="619"></iframe>
 </div>
 <div class="blog-content">
 Maybe you don’t need extra power layers in your PCB and using tracks for power distribution may be just ok. An interesting discussion with Eric Bogatin.
 </div>
 <div class="blog-content-chapters">
 <div>
 Chapters:
 </div>
 <ul class="chapters-list">
 <li class="chapters-list-item">
 00:00What is this video about
 </li>
 <li class="chapters-list-item">
 00:35Maximum current through a PCB track
 </li>
 <li class="chapters-list-item">
 03:40Stackups: SGSS, SGSG, GSSG (S – Signal, G – GND)
 </li>
 <li class="chapters-list-item">
 10:31Stackups SGGS vs SGPS (P – Power)
 </li>
 <li class="chapters-list-item">
 37:10Real examples – Measured noise
 </li>
 <li class="chapters-list-item">
 54:55Real examples – Emissions
 </li>
 </ul>
 </div>
 <div class="blog-content-links">
 <div>
 Links:
 </div>
 <ul class="links-list">
 <li class="links-list-item"><a href="https://www.bethesignal.com/bogatin/3monthsubscription.php">Signal Integrity Academy (use FEDSI - 3 months free)</a></li>
 <li class="links-list-item"><a href="https://fedevel.com/courses">FEDEVEL courses</a></li>
 </ul>
 </div> 
</div>

Do You Really Need Power Planes? Are you sure? | Eric Bogatin

<div class="entry-content">
 <div class="jetpack-video-wrapper"><iframe
 class="youtube-player"
 src="https://www.youtube.com/embed/yQIBS5xwvVQ?version=3&rel=1&showsearch=0&showinfo=1&iv_load_policy=1&fs=1&hl=en&autohide=2&wmode=transparent"
 allowfullscreen="true"
 style="border: 0px; display: block; margin: 0px; width: 740px; height: 416.418px;"
 sandbox="allow-scripts allow-same-origin allow-popups allow-presentation"
 data-ratio="0.5627272727272727" data-width="1100" data-height="619"></iframe>
 </div>
 <div class="blog-content">
 Watch this animation to understand better how a signal is lost when travelling through a VIA.
 </div>
 <div class="blog-content-chapters">
 <div>
 Chapters:
 </div>
 <ul class="chapters-list">
 <li class="chapters-list-item">
 00:00What is this video about
 </li>
 <li class="chapters-list-item">
 01:14Example 1: Single ended, no stitching VIA
 </li>
 <li class="chapters-list-item">
 06:08Example 2: Single ended, 1 stitching VIA
 </li>
 <li class="chapters-list-item">
 10:17Example 3: Single ended, 2 and 6 stitching VIAs
 </li>
 <li class="chapters-list-item">
 12:43VIA Analyzer – How far we can place stitching VIAs and how many we need
 </li>
 <li class="chapters-list-item">
 16:50Post layout analyzes
 </li>
 <li class="chapters-list-item">
 21:14Changing VIA impedance
 </li>
 <li class="chapters-list-item">
 32:45Example 4: Differential pair, no stitching VIA
 </li>
 <li class="chapters-list-item">
 36:10Example 5: Differential pair, 2 stitching VIAs
 </li>
 <li class="chapters-list-item">
 48:181x VIA + 1x stitching VIA return current
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 <li class="chapters-list-item">
 55:20About the software we were using + Prices
 </li>
 </ul>
 </div>
 <div class="blog-content-links">
 <div>
 Links:
 </div>
 <ul class="links-list">
 <li class="links-list-item"><a href="https://youtu.be/vrt3lL5gEb0">Unexpected Currents On The Other Side Of GND Plane</a></li>
 <li class="links-list-item"><a href="https://www.linkedin.com/in/yuriy-shlepnev-7b39136/">Yuriy's Linkedin</a></li>
 <li class="links-list-item"><a href="https://www.simberian.com/">Yuriy's website</a></li>
 </ul>
 </div> 
</div>

NOT in the Copper! 3D Animation of a Signal Through a VIA | Yuriy Shlepnev

<div class="entry-content"> The video explains how to create / add a 3D model to a component in Altium Designer PCB layout. Also explains how to add other SYSTEM 3D parts into board model. See the real picture of the PCB from this video at&nbsp;<a href="http://www.fedevel.com/welldoneblog/2011/09/altium-designer-3d-model-and-real-pcb-side-by-side/">Altium Designer â€“ 3D Model and Real PCB side by side</a> <div class="jetpack-video-wrapper"><iframe class="youtube-player" src="https://www.youtube.com/embed/k3Dz0KckiSM?version=3&amp;rel=1&amp;showsearch=0&amp;showinfo=1&amp;iv_load_policy=1&amp;fs=1&amp;hl=en&amp;autohide=2&amp;wmode=transparent" allowfullscreen="true" style="border: 0px; display: block; margin: 0px; width: 740px; height: 416.418px;" sandbox="allow-scripts allow-same-origin allow-popups allow-presentation" data-ratio="0.5627272727272727" data-width="1100" data-height="619"></iframe></div> Please LIKE, Share, ReTweet. Thank you. </div>

Altium Designer â€“ 3D model of your PCB â€“ itâ€™s really easy

<div class="entry-content"> There are two options: 1) Leave your PCB manufacturer to design PCB stackup for you (Recommended) Why? <ul> <li>You donâ€™t need to spend your time by designing stackup. Leave it on PCB manufacturer â€“ they are professionals. They do it every day. Also, by doing it this way, you can work on design in parallel of handling issues with PCB stackup.</li> <li>Many times PCB manufacturer is not able to build PCB stackup designed by other company or a person outside&nbsp;their&nbsp;company. The main reason is unavailability of material used in some PCB stackups. Selection of material is the best to leave on them â€“ they will choose stocked material.</li> <li>PCB manufacturers use different track geometry calculators and they will not guarantee track impedance if track geometry is calculated by someone else. Many times their calculated numbers and your calculated numbers will be different.</li> </ul> An example of email to PCB manufacturer with request for PCB stackup and track geometry <div style="border:1px solid #aaaaaa;background-color:#eaeaea;"> Please suggest PCB stackup and track geometry for PCB with following parameters: PCB Description â€“ 12 Layers: L1 â€“ Signal L2 â€“ GND L3 â€“ Signal L4 â€“ Signal L5 â€“ GND L6 â€“ Powers L7 â€“ Powers L8 â€“ GND L9 â€“ Signal L10 â€“ Signal L11 â€“ GND L12 â€“ Signal Please suggest stackup. â€“ Required impedances: Single ended: 50 OHMs (L1 (Ref: L2); L3, L4 (Ref: L2, L5);&nbsp;L9, L10 (Ref: L8, L11);&nbsp;L12 (Ref: L11)) Differential: 70, 90, 100 OHMs (L1 (Ref: L2); L3, L4 (Ref: L2, L5); &nbsp;L9, L10 (Ref: L8, L11); L12 (Ref: L11)) Please suggest geometry for impedance controlled tracks:&nbsp;Track width / Gap â€“ Used VIAs: Through hole VIA: 0.45mm (pad) / 0.2mm (drill), Start layer: L1, End layer: L12 uVIAs: Start layer: L1, End layer: L2; 0.27mm (pad) / 0.1mm (laser drilled hole) Start layer: L2, End layer: L3; 0.27mm (pad) / 0.1mm (laser drilled hole) Start layer: L10, End layer: L11; 0.27mm (pad) / 0.1mm (laser drilled hole) Start layer: L11, End layer: L12; 0.27mm (pad) / 0.1mm (laser drilled hole) Buried VIA: Start Layer: L3, End layer: L10; 0.45mm (pad) / 0.2mm (drill) â€“ Other: Minimum track: 0.1mm / Minimum gap: 0.1mm Board thickness: approximately 1.6mm Board size: 40x80mm </div> &nbsp; 2) Design PCB stackup by yourself Basic information about PCB stackups: <ul> <li>PCB is build from three basic materials: Copper foil, Prepreg, Core</li> <li>Standard Copper foil thickness: 5um, 12um, 18um, 35um, 70um</li> <li>Standard prepreg thickness: 65um, 100um, 180um</li> <li>Standard core thickness: 0.15mm, 0.20mm, 0.36mm, 0.46mm, 0.56mm, 0.71mm, 1mm, 1.2mm, 1.5mm, 2.0mm, 2.4mm, 3.2mm. Core is supplied with copper foil on both sides. For some cores you need to add copper foil thickness (18um or 35um) to the core thickness.</li> </ul> PCB stackup examples <table> <tbody> <tr> <td>Standard 4 Layer PCB stackup [mm]</td> <td>Standard 6 Layer PCB stackup [mm]</td> <td>Standard 8 Layer PCB stackup [mm]</td> </tr> <tr> <td>Copper foil 0.18 prepreg 0.18 prepreg 0.71 core 0.18 prepreg 0.18 prepreg Copper foil</td> <td>Copper foil 0.10 prepreg 0.10 prepreg 0.36 core 0.10 prepreg 0.10 prepreg 0.10 prepreg 0.36 core 0.10 prepreg 0.10 prepreg Copper foil</td> <td>Copper foil 0.10 prepreg 0.10 prepreg 0.20 core 0.10 prepreg 0.10 prepreg 0.20 core 0.10 prepreg 0.10 prepreg 0.20 core 0.10 prepreg 0.10 prepreg Copper foil</td> </tr> </tbody> </table> There are some rules how to build your stackup. Not every combination is possible. Check it out with your PCB manufacturer. Note: If you calculate impedances for your own stackup, donâ€™t forget about PLATING. Plating process add an&nbsp;additional&nbsp;copper (e.g. 20um) &nbsp;to top and bottom layer (or if you use uVIAs and buried VIAs, then also to some of the inner layers). PCB impedance calculation and Track geometry design Example of Microstrip (the tracks on TOP and BOTTOM layers) impedance calculation 90 Ohms Differential / 55 Ohm Single ended for: Track width: 11mil / Copper foil 18um (0.7mil) /&nbsp;Track Gap 8 mil /&nbsp;Dielectric&nbsp;thickness 2x 0.1 prepreg = 0.2mm (7.8mil) / material FR-4 (dielectric constant 4.8) <a href="http://www.fedevel.com/welldoneblog/2011/08/pcb-impedance-calculator-single-ended-differential-pair/">PCB impedance calculator â€“ Single ended / Differential pair</a> <a style="color:#ff4b33;" href="https://welldoneblogfedevel.files.wordpress.com/2019/10/4d7a9-diff-impedance-90_55.jpg"><img data-attachment-id="1266" data-permalink="https://welldoneblog.fedevel.com/2011/08/15/how-to-design-pcb-stackup/diff-impedance-90_55/" data-orig-file="https://welldoneblogfedevel.files.wordpress.com/2019/10/4d7a9-diff-impedance-90_55.jpg" data-orig-size="706,321" data-comments-opened="1" data-image-meta="{&quot;aperture&quot;:&quot;0&quot;,&quot;credit&quot;:&quot;&quot;,&quot;camera&quot;:&quot;&quot;,&quot;caption&quot;:&quot;&quot;,&quot;created_timestamp&quot;:&quot;0&quot;,&quot;copyright&quot;:&quot;&quot;,&quot;focal_length&quot;:&quot;0&quot;,&quot;iso&quot;:&quot;0&quot;,&quot;shutter_speed&quot;:&quot;0&quot;,&quot;title&quot;:&quot;&quot;,&quot;orientation&quot;:&quot;0&quot;}" data-image-title="diff impedance 90_55" data-image-description="" data-image-caption="" data-medium-file="https://welldoneblogfedevel.files.wordpress.com/2019/10/4d7a9-diff-impedance-90_55.jpg?w=300" data-large-file="https://welldoneblogfedevel.files.wordpress.com/2019/10/4d7a9-diff-impedance-90_55.jpg?w=706" class="alignleft size-full wp-image-1266" style="border-style:initial;border-color:initial;" title="diff impedance 90_55" src="https://welldoneblogfedevel.files.wordpress.com/2019/10/4d7a9-diff-impedance-90_55.jpg?w=1100" alt="" srcset="https://welldoneblogfedevel.files.wordpress.com/2019/10/4d7a9-diff-impedance-90_55.jpg 706w, https://welldoneblogfedevel.files.wordpress.com/2019/10/4d7a9-diff-impedance-90_55.jpg?w=150 150w, https://welldoneblogfedevel.files.wordpress.com/2019/10/4d7a9-diff-impedance-90_55.jpg?w=300 300w" sizes="(max-width: 706px) 100vw, 706px"></a> <div>&nbsp;</div> &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; <a href="https://welldoneblogfedevel.files.wordpress.com/2019/10/4d7a9-diff-impedance-90_55.jpg"> </a>Tip: Itâ€™s easy to convert between mm and mils. Use google and look for: â€ś10mil to mmâ€ť or â€ś0.2mm to milâ€ť Please Comment, LIKE, Share, ReTweet. Thank you. </div>

How to design PCB stackup

<div class="entry-content"> OPEN: A good client of mine (VOIPAC) is looking for a Freescale Windows CE Software Engineer to develop Win CE BSP for their <a href="http://www.voipac.com/#X25-DKT-265" target="_blank">iMX25</a> and <a href="http://www.voipac.com/#X51-DKT-587" target="_blank">iMX51</a> developmnet kits. In case you are interested or you know someone who would be interested, <a href="http://www.fedevel.com/welldoneblog/robert-feranec-contact-form/">contact me</a> or <a href="http://www.voipac.com/#Contact" target="_blank">VOIPAC</a> directly. </div>

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Must Know This to Understand High Speed PCB Layout Simulation | S-Parameters Explained, Eric Bogatin

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NOT in the Copper! 3D Animation of a Signal Through a VIA | Yuriy Shlepnev

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