Hi,I am currently doing a 4-layer RF design and I was just wondering if there are any MAJOR drawbacks from an RF/EMI/EMC perspective with using 2 internal gnd planes or using one for gnd and one for power
QDrives , 08-15-2025, 09:46 PM
It depends... Not so much on the stack-up, but how you fill the layers.You will need to used capacitors and not just vias to continue the return path.
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