FEDEVEL
Platform forum

, 04-13-2025, 01:53 AM

The Copper Zone settings for a copper fill in KiCAD has a section for pads which allows using thermal reliefs for connecting to planes and parameters to adjust the reliefs. There is no section for vias at all in KiCAD that I can find and nothing on via properties that can allow the use of thermal vias, nothing in the design rules either which can set a way to setup thermal reliefs for vias. Does KiCAD support this and if so how is it done. I have already gone through the content in the "Mixed Signal Hardware Design" course taught by Philip Salmony.