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4 Layer Stackup for Susceptibility

SeargentGranny , 09-03-2023, 09:40 PM
I am working with a BQ40z80 TI BMS chipset .

This chipper has very sensitive current sense lines that can be affected by minimal RF signals from only a few feet away.

I want to make a 4-layer PCB with the stackup SIG-GND-SIG-GND.

Is this accepatable?
Robert Feranec , 09-04-2023, 01:30 PM
I checked datasheet and they have layout section there. I would probably route the signals above a solid GND plane, I would place this GND plane as close as possible to the signals and I would keep the tracks as short as possible. I am not sure what your plan is.
SeargentGranny , 09-05-2023, 01:43 AM
My plan was to make layer 2 GND and most of layer 4 a GND plane and place the current sense lines between them.

The problem I have is the way this pack is designed. The sense resistor is about 35mm away from the chipset, with no option to move closer.
QDrives , 09-07-2023, 08:51 PM
On page 33 there are some layout consideration for the sense resistor as well as the mentioning of a filter. Route the signal lines as a differential pair.
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