qdrives , 10-07-2022, 05:26 PM
I think that your question is to why are the uncoated pads in an assembly (A6) treated differently than uncoated outer layer tracks (B2).
A very good question.
Sometimes B2 is more than A6, other times it is the opposite.
In the past I took the maximum of B2 and A6, but on those designs I had the space (<60Vdc).
However, my current requires much lower clearances so I am forced to look to conformal coating.
Also do not forget the vertical spacing (layer to layer)
By the way, permanent polymer coating is the solder mask or solder resist.
Put simply, there are 3 things to consider:
1) Covering the copper (internal layes - FR4 = B1, solder resist = B4, or conformal coating = A5 and A7)
2) Altitude
3) Bare board vs assembled board.
At 251-300 there is the difference between A5 and A7. All others are equal.
Perhaps it is like the current carrying capability graph of IPC - 'measured' in the sixties.