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Via in Pad

Harkirat S Virk , 04-18-2019, 04:52 PM
I am working with 14x14mm iMX6SX which has a 0.65 ball pitch. I am having a problem with the through hole via. The 0.2mm/0.45mm standard PTH does not really fit into the 0.65 pitch.
I am considering via in pad option. If someone can direct me to resources for implementing via on pad in altium including the design rules.


In another post Robert suggested going down to 0.15mm on the through hole via. That is still not fitting the requirement.

Also, If someone can suggest a manufacturing entity that can do turnkey prototyping with these specifications.
Harkirat S Virk , 04-19-2019, 02:19 AM
followup question: do i need to keep an annular ring on the via when putting it on the pad? I am considering i can keep the annular ring as zero for the via as the pad dia will give me sufficient copper to fan out from it.
robertferanec , 04-25-2019, 05:15 AM
This may help you, similar applies to your board: https://www.fedevel.com/designhelp/f...apq8016-fanout
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