FEDEVEL
Platform forum

return0 , 01-27-2024, 05:47 PM

What is the correct way of removing the solder mask from the bottom layer?
I need to place a heat sink under the thermal vias for an IC. Should I use a fill or a solid region and then change the layer to "Bottom solder"?
What would you recommend for doing such a thing?

QDrives , 01-27-2024, 08:32 PM

A fill is a rectangle, period. A solid region can be in any shape.
Select the bottom solder first and then place either.
Alternatively, if you have a shape in copper, you can just set the solder mask expansion to "rule" or set the tickbox in manual to add a defined expansion.

return0 , 01-27-2024, 09:41 PM

Thanks!