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PMICnewbie , 02-13-2024, 12:50 AM

While chosing Vendor Sym, footprints and related stuff, how would one choose the different displays:
I tried looking into datasheets regarding package info, but how exactly does one choose among the "type of pad sizes per footprint for IPC specification"?

Also is it OK to choose different package types/ footprint types for different elements/ICs of the PCB, like eg; DBV package for a INV gate, DCK package for a NOR gate and DRY package for a NAND gate, if someone can shed some advice on the advantages of one package over the other (by the way these packages are Texas Instruments related)

PMICnewbie , 02-13-2024, 12:51 AM

When Choosing Vendor Model Display Sizes

Robert Feranec , 02-13-2024, 10:57 AM

display: usually we use the one recommended for long term availability. Other footprints: usually based on the size of the board (the smallest footprint is board needs to be small) or if I need compatibility between different chip manufacturers (sometimes you can find the same chip in the same fooptrint between number of different chip manufacturers), possibly if components will be soldered manually (you would like to use a bigger footprint). If board size is not an issue I do not use the smallest footprints. Bigger footprints are more reliable and easier to work with if needed (e.g. rework, measure, etc)

PMICnewbie , 02-13-2024, 11:05 AM

Thank you, @Robert Feranec , yes I was also advised that since it will be self soldering bigger footprint is easier to work with