I have made the same experience just yesterday. I have the signals on adjacent layer with GND and I copied reference design for my MPU (one x16 RAM package only). There is the same 2R+1C to GND circuitry at CLK signals, but it is actually a stub, that continues from RAM BGA to termination passives.
I left the termination non populated and forget about it, because board is working so far. I would like to know more regarding is the termination necessary? For which signals? How does it cope with "on die termination" included in DDR3 chips? In my case it only point to point design, with just one x16 BGA DDR3. The TN4614 from Micron is a good resource but most of these resources is discussing more complex topology than my case.
I tried to use 100R between CLK signals because of the EMI, it helped, but EMI is still too high. EMI is irradiated exactly at DDR frequency (552MHz), when I set RAM to 360MHz, it peak moved exactly to 360MHz (peak is also lower, so I assume board is not able to irradiate this freq so good). Looking hard for a remedy right now