Normally I try to avoid using too many VIAs in one signal (not recommended for high speed signals), but at the same time I have to consider "no or minimum stubs" requirement (stubs are also not recommended for high speed signals). Sounds complicated?
So, for example, we use uVIAs for L1-L3 and L10-L12, we use buried VIA for L3-L10 and for anything else (including L1-L10) we use through hole VIAs. For very high speed signals, we may only use through hole VIA and route them on TOP and BOTTOM only, or we use a special stackup (e.g. uVIAs directly from L1-L3).