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JohnsonMiller , 08-31-2021, 01:25 AM
Hi Guys,

I am dealing with wafer level chip scale package (WLCSP) devices, the pin pitch is very low 0.4mm and it needs uVIA and laser drilling, wondering do you have working experience with this sort of packages?
WhoKnewKnows , 08-31-2021, 05:32 AM
Very little experience with microvias. I worked with the fab shop to develop specifications.
robertferanec , 09-02-2021, 06:02 AM
I try to avoid so small chips. If I would have to use it, I would probably follow the reference design.
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