FEDEVEL
Platform forum

Izakl , 11-14-2019, 02:30 AM

I need to work with resistive foil in a design, e.g. OhmegaPly or Ticer's TCR. If you're not familiar with it; it is a copper foil with a very thin resistive material on the bottom side. This resistive material faces the substrate. I am aware that Altium makes provision for buried passives on an inner layer, but the connection between the outer layer and inner layer is through a via. With resistive foil the connection is from the top layer to the bottom of the top layer if that makes sense. How would one handle the stackup and routing in Altium? Have anyone done this in Altium?

robertferanec , 11-15-2019, 11:53 AM

Honestly, I do not know. Maybe someone else?