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Power & Signal Integrity Series Part 3 - Advanced Materials, Manufacturing, and Techniques
Focusing on frequency dependent losses - what happens from 5Gbps and up. How to make a via. Understanding PCB materials, manufacturing, and how to define a good stackup. And finally, how to not screw it all up by picking the wrong surface finish.
In this Power & Signal Integrity course series (Part 1 - Part 3), you will learn how to predict and quantify reflections, crosstalk, ground bounce, supply ripple, and loss. These are the basic signal-integrity issues in any modern digital design. Keep the total impact of those within the noise margin, and your system will work as predicted. The goal of this course series is to reduce the number of board revisions of your designs by understanding the potential signal integrity problems before you build the first prototype. Most of the companies that have participated in previous courses have achieved this.
Examples used through the material include the design of DDR memory systems, clocks, fast LVDS differential buses, PCIe, PCI, and similar buses. This course series covers everything from the basic concepts to designing boards to handle 56 Gbps signaling and beyond.
As a basis for this course series lies 20+ years of teaching and consulting in this subject for 2000+ real hardware design engineers from all types of industries.
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