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Advanced Layout Design - microvias and capacitance

kevbot , 04-25-2023, 10:22 AM

I had a question about using microvias in layer two of the Advanced Layout course.

During fanout under the BGA, we use microvias to move to layer 2 and then use another microvia to layer 3. (It's necessary because we need a reference ground plane for layer 2.) My question is, why did we route the signal underneath the track on layer 1? I thought we would want to avoid going directly under this route since it adds undesirable capacitance - with the tracks being the plates of the capacitor.

I appreciate any thoughts on the matter.

robertferanec , 04-27-2023, 03:01 AM
I didn't want to use VIAs in pad nor stacked VIAs - these would make the PCB more expensive.
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